Multi-Die Design Start Guide

As multi-die integration using 2.5D and 3D technologies gains traction across the semiconductor industry, engineering teams face new design complexities that span IP selection, tool readiness, and methodology planning. This white paper offers a practical roadmap for first-time success with multi-die design. From understanding the key advantages and drivers of adoption to identifying the foundational steps needed at project kickoff, this guide equips you with the insights to confidently move from concept to implementation—faster and with fewer surprises.

Please fill your information below to download the white paper.

* First Name

* Last Name

* Business Email

* Job Title

* Company

* Postal Code

* City

* State

* Country

* Industry

* Phone Number

I authorize Synopsys and its distributors to contact me by email and telephone to provide information about its products and services. I understand that I can change my preference at any time by clicking 'Unsubscribe' or by accessing Synopsys' Subscriptions Center, and that my personal data will be handled subject to the Synopsys Privacy Policy.

By checking this box I agree to receive information regarding EETech, products and services. I understand that I can opt out at any time. Please read our privacy policy to access your data rights.